第二、三代鎳基單晶高溫合金含Hf過(guò)渡液相(TLP)連接
發(fā)布人：上海艾荔艾金屬材料有限公司www.bt990.com.cn
更新時(shí)間：2016-01-05
采用無(wú) B 的含 Hf 鎳基合金作為中間層合金, 分別對(duì)含 Re 的第二代鎳基單晶高溫合金 (CMSX-4, 鑄態(tài)) 和第三代鎳基單晶高溫合金 (SXG3, 完全熱處理態(tài)) 進(jìn)行 TLP 連接, 并分析了連接區(qū)的顯微組織演變以及降熔元素分布, 測(cè)試了連接區(qū)的顯微硬度.
第二、三代鎳基單晶高溫合金含Hf過(guò)渡液相(TLP)連接TRANSIENT LIQUID PHASE BONDING OF SECOND AND THIRD?GERNERATION Ni-BASED SINGLE CRYSTAL SUPERALLOY WITH?Hf-CONTAINING INTERLATYER ALLOY采用無(wú) B 的含 Hf 鎳基合金作為中間層合金, 分別對(duì)含 Re 的第二代鎳基單晶高溫合金 (CMSX-4, 鑄態(tài)) 和第三代鎳基單晶高溫合金?(SXG3, 完全熱處理態(tài)) 進(jìn)行 TLP 連接, 并分析了連接區(qū)的顯微組織演變以及降熔元素分布, 測(cè)試了連接區(qū)的顯微硬度. 結(jié)果表明, 在 1290 ℃真空保溫 24 h 后, CMSX-4 和 SXG3 合金的 TLP 連接均已完成, 2 種合金的 TLP 連接過(guò)程也均符合經(jīng)典模型. 以含 Hf 的鎳基合金作為中間層合金時(shí), 在連接區(qū)內(nèi)沒(méi)有出現(xiàn)擴(kuò)散影響區(qū). CMSX-4 合金的固溶處理可在 TLP 連接過(guò)程中同步完成, 縮短了熱處理工藝. SXG3 合金中的 C 與 Hf 結(jié)合在液相中形成固相 HfC, 降低熔體中 Hf 濃度, 縮短了等溫凝固階段的時(shí)間. 研究表明, 通過(guò) TLP 連接可以研究小角度晶界的界面穩(wěn)定性, 其中在 1150 ℃保溫?zé)崽幚?/span>后, SXG3 合金小角度晶界出現(xiàn)不連續(xù)脫溶轉(zhuǎn)變的臨界區(qū)間在 10°~17°之間.?
A Hf-containning Ni-based alloy was used as the interlayer alloy of TLP bonding for the 2nd?(CMSX-4, as-cast condition) and 3rd (SXG3, standard heat treatment condition) generation Ni-based single?crystal superalloys containing Re in this work, and the microstructure, composition and micro-hardness of?bonding zone were characterized. The results show that the TLP bonding of CMSX-4 and SXG3 alloy were?completed after bonded at 1290 ℃ in vacuum for 24 h. These TLP bonding process of CMSX-4 and SXG3?alloys can be explained well using classical TLP model. The diffusion affected zone was not observed during the?TLP bonding process. In addition, the heat treatment process of CMSX-4 is shortened by 24 h resulted from the?solid solution heat treatment of CMSX-4 alloy has been completed after the process of TLP bonding. The?isothermal solidification stage of SXG3 alloy was also accelerated due to the precipitation of HfC at the bonding?temperature, resulting in the reduced Hf concentration of Hf in the melting zone. Our study also indicates that the?interfacial stability of low angle grain boundaries can be investigated by the TLP bonding. The critical?misorientation value for discontinuous precipitation of SXG3 alloy along low angle grain boundaries was in?between 10o and 17o after heat treatment at 1150 ℃.?
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